Physicists have turned a long-standing imaging workhorse into a kind of nanoscale chisel, using a razor-precise ion beam to ...

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

Leti, the next-generation chip stacking will be a key enabler for More-Than-Moore devices and applications, going forward ...

Keysight Technologies, Inc. has released the new Machine Learning Toolkit in the latest Keysight Device Modelling Software Suite. This new solution decreases model development and extraction time from ...

After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor transistors.

When existing advanced 2D designs already push the limits of design-for-test (DFT) tools, what hope do developers have of managing DFT for 3D devices? Can anyone afford the tool run time, on-chip area ...

San Jose, Ca. ” On the heels of its agreement with Programmable Integrated Circuit Co. for creating 3-D flash memory, Terrazon Semiconductor has implemented an 8051 microcontroller IP core from CAST, ...