TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of 5G RF module ...

BARCELONA, Spain, March 4, 2025 /PRNewswire/ — Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, announced the launch of its new 5G modules ...

IRVINE, Calif., Feb. 22, 2024 /PRNewswire/ -- Telit Cinterion, an end-to-end IoT solutions enabler, announces the Telit Cinterion FE990B34/40 LGA family of modules, powered by the Snapdragon® X72 5G ...

For 5G smartphones and other millimeter wave (mmWave) applications, antenna integration off the board and into the package, simplifies the design challenges endemic to high-frequency devices. These ...

The fifth-generation (5G) mobile network introduces significant changes compared with the previous 4G technology, including the use of multiple sub-1-GHz, 1- to 6-GHz, and above 6-GHz (millimeter-wave ...

SHANGHAI, May 21, 2021 /PRNewswire/ -- Quectel Wireless Solutions, the leading global supplier of IoT modules has announced the release of two new 5G New Radio (NR) module series, the RG500S and ...

With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for ...

The latest 5G standards releases from 3GPP have formalized and advanced many features that have increased the utility and complexity of 5G hardware. Enhanced mobile broadband (eMBB), ultra-reliable ...

PARIS--(BUSINESS WIRE)--Sequans Communications S.A. (NYSE: SQNS), leading developer and provider of 5G/4G chips and modules, announced that two of its Monarch IoT modules, Monarch SiP and Monarch ...

SHANGHAI, Feb. 10, 2021 /CNW/ -- Quectel Wireless Solutions, the leading global supplier of Internet of Things (IoT) modules, today announced the release of second generation 5G new radio (NR) modules ...

Backend house ShunSin Technology, a subsidiary of Foxconn Technology (Hon Hai Precision) specializing in system-in-package (SiP) modules, is poised to reap handsome income by rendering packaging ...

System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules and power ...