The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

The benefits of chip-scale packages are fairly obvious. In space-constrained, very dense designs, every bit of board space is precious. Chip-scale packaging, which eliminates the extra space along the ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Manufacturers of chip-scale packages are stacking devices two and three high in an effort to cram more functionality in less board space. At the same time, vendors are working to lower package ...