Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
Semiconductor process engineers have always understood the need to inspect silicon wafers to identify defects and eliminate them at their source. To simplify the process, semiconductor equipment ...
HSINCHU, Taiwan — September 10, 2008 — Rohm and Haas Electronic Materials (NYSE:ROH), CMP Technologies, a leader and innovator in chemical mechanical planarization (CMP) technology for the global ...
(MENAFN- PR Newswire) "Wafer mass metrology has become increasingly important as semiconductor processes have become more complex and sensitive," said Microtronic CEO Reiner Fenske in making the ...
HAWTHORNE, N.Y., July 17, 2020 /PRNewswire/ -- SEMICON West 2020 – Microtronic, maker of high-speed full-wafer macro defect inspection systems and software, has just announced an innovative new way to ...
ACM Research Introduces New Post-CMP Cleaning Tool for Silicon and SiC Wafer Substrate Manufacturing
FREMONT, Calif., July 12, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
What is the Market Size of Wafer Defect Inspection System? BANGALORE, India, Dec. 16, 2025 /PRNewswire/ -- In 2024, the global market size of Wafer Defect Inspection System was estimated to be worth ...
In this interview, Mark Bumiller, Technology Manager for Entegris talks to AZoM about using the Accusizer to detect large particles counts in CMP slurries. Please could you give us an introduction to ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--June 25, 2003--Applied Materials, Inc. (Nasdaq:AMAT) announces Reflexion(R) LK, the industry's only low down force, high throughput CMP (chemical mechanical ...
Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...
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