The new A20 Pro chip is expected to debut in Apple’s iPhone Fold and iPhone 18 Pro, delivering major performance and ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

Apple's 2026 iPhones will use TSMC's next-generation 2-nanometer fabrication process in combination with a new packaging method that will integrate 12GB of RAM, a reputable source of accurate ...

We’re just weeks away from Apple unveiling its iPhone 17 lineup, but a new report corroborates prior indications that next year’s iPhone 18 models are due for an especially strong performance boost ...

Able to perform in circuits operating at frequencies as high as 1 MHz, the PIP212-12M chip-scale power module claims on-board space savings of up to 50%, conversion efficiencies as high as 94%, and up ...

Apple's next iPhone 17 models are expected to be the last to feature a 3nm chip. This technology was first introduced with the iPhone 14 Pro, and Apple has been improving its manufacturing processes.

The smartphone industry may see a major shift this year in terms of pricing. The majority of the credit goes to the DRAM, and then comes the chip costs. The year 2026 will see a breakthrough into the ...

We are all familiar enough by now with the succession of boards that have come from Raspberry Pi in Cambridge over the years, ...