Applied Materials and Lam Research supply the essential factory tools required to build the advanced processors driving the ...

Rapidus has successfully begun installing ASML's Twinscan NXE:3800E EUV lithography system at its Innovative Integration for Manufacturing (IIM-1) facility in Chitose, Hokkaido, marking a significant ...

BE Semiconductor Industries is a key player in die-attach and packaging equipment, critical for advanced chip manufacturing. BESIY benefits from AI-driven chip demand and leads in advanced die attach ...

Global sales of equipment for semiconductor manufacturing by original equipment manufacturers (OEMs) is forecast to reach a ...

Hanmi Semiconductor, a rising force in semiconductor equipment manufacturing, is rapidly expanding its influence in the AI hardware ecosystem. After establishing dominance in the critical thermal ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

The growing demand for advanced chip-packaging equipment, thanks to AI, could be a tailwind for this company. It is trading at an attractive valuation right now. A potential acceleration in growth ...

Dutch chip gear maker ASML has lifted the kimono its Twinscan XT:260, a new lithography scanner built for the brave new world of 3D chip packaging. The outfit claims that it is the first machine of ...

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic ...

This article was originally published on ARPU. View the original post here. In a prominently placed interview with China's state newspaper, Huawei founder Ren Zhengfei sent a clear message to ...