Share and share alike! Our mothers always said it was the right thing to do, and it seems that this ideology is now coming front and center for double patterning at 20nm and below. As we continue to ...
As the unstoppable progression of Moore’s law has driven the semiconductor technology roadmap farther and farther below 1 µm, a steady stream of engineering marvels has been required to produce ...
The big joke about extreme ultraviolet (EUV) technology is that it takes seven trucks to deliver the mammoth tools compared to one for other advanced lithography tools — but actually, this is no joke.
TSMC is planning to adopt double patterning extensively at 20nm, despite the high cost of doing so. Why? Because EUV hasn't come through. Share on Facebook (opens in a new window) Share on X (opens in ...
SAN JOSE, Calif. — Immersion lithography could be late to the market, forcing chip makers to consider 193-nm “dry” and double-exposure techniques for chip production at the 45-nm node and beyond, ...
Scanner resolution improvements have diminished since the 193-nm wavelength became commonplace. Today’s technologies are sufficient for 28-nm IC designs using immersion, but not beyond without ...
BELMONT, Calif.--(BUSINESS WIRE)--Nikon Corporation has announced they will provide an immersion scanner for Double Patterning, based on the successful NSR-S610C platform, to their customers in the ...
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