Semiconductor Engineering

Using Test And Metrology Data For Dynamic Process Control

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Semiconductor Engineering

Using Critical Area To Boost Automotive IC Test Quality

To compete in the fast-growing market for automotive ICs, semiconductor companies need to address new challenges across the entire design flow. To meet the ISO 26262 goal of zero defective parts per ...
Electronic Design

Using Timing Constraints For Generating At-Speed Test Patterns

Handling timing exception paths in ATPG tools while creating at-speed patterns has always been a tough and tricky task. It is well understood that at-speed testing is a requirement for modern ...
Electronic Design

Design for Test: ATPG keeps pace with design complexity

Automatic test-pattern generation (ATPG) has played a key role in semiconductor logic test, but several trends driving the need for semiconductor test quality are challenging traditional ATPG tools.