Monitoring Critical Process Steps In 3D NAND Using Picosecond Ultrasonic Metrology With Both Thickness And Sound Velocity Capabilities Applications of picosecond ultrasonics in 3D NAND show potential ...
The semiconductor manufacturing process involves many steps, including, but not limited to, film deposition, photolithography, etching, and chemical mechanical polishing (CMP). Contamination can ...
Aim: To demonstrate the potential of in-line nanoparticle size measurements using the NanoFlowSizer (NFS) as a PAT method. To achieve real-time process control by establishing automated regulation of ...
Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
Traditionally, vaccine manufacture has accounted for a huge amount of aseptic production. In recent years, there has been a larger focus on novel biologic therapies, of which the majority are ...
Aseptic processing demands reliable, robust, and validated analytical methods to ensure sterility, safety, and quality, ...
Editor’s note: This article is the third in a series to help practitioners learn about the AICPA’s new quality management standards and prepare to implement them. The new final standards on quality ...
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