Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are ...
Fairchild Semiconductor's FDMF6700 is an optimized and integrated FET-plus-driver power stage in a 6-mm x 6-mm MLP package. Fairchild Semiconductor’s FDMF6700 is an optimized and integrated ...
NeoGene Tech, a Guangzhou-based Taiwanese thermal management solution provider, has in Q3 2022 supported Xiaomi to successfully launch its flagship 5G smartphone, Xiaomi 12S Ultra, with excellent ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
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First India-made chip module sent to US firm AOS
India’s first commercially packaged multi-chip module (MCM) was rolled out of Kaynes Semicon’s outsourced semiconductor assembly and test (OSAT) facility in Sanand in the wee hours of Wednesday and ...
Addressing the need for higher frequency and current in dc/dc converters, the TB7001FL multi-chip module combines a high side MOSFET, a MOSBD to handle low-side functions, and a driver IC that ...
TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...
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