System-in-package solutions offer a seemingly limitless combination of silicon, package and component technologies. They can provide enough integration to complement system-on-chip applications by ...

RF SiP technology is an enabling packaging platform for wireless communication, which is constrained by the fact that, today, SiP design is an “expert engineering” process—one that is not scalable as ...

The ISP2454‑LX, which is currently in production, includes the full set of power‑saving features, including the 32kHz crystal ...

Thanks to advances in circuit miniaturization and systemin- package (SiP) technology, the goals of smaller size and more functionality have become attainable. Thanks to advances in circuit ...

The ISP2454-LX family from Insight SIP is a Bluetooth Low Energy module platform built on Nordic Semiconductor’s nRF54L15 SoC ...

System-on-chip (SoC) and system-in-package (SiP) solutions offer benefits in terms of component count and complexity. Thus, it’s important for designers to understand the pros and cons of each when ...

By using advanced "3D stacking" technology, Izmo re-engineered a standard 200mm x 200mm electronics board into a compact 81mm ...

U-blox has debuted the ALEX-R5, a miniature cellular module that integrates low power wide area connectivity and GNSS technology into an ultra-small system-in-package (SiP) form factor. According to u ...

Universal Scientific Industrial (Shanghai) Co., Ltd., (SSE 601231), a leading global company in electronic design and manufacturing, is going to launch WM-BAC-CYW-33 SiP (System in Package) module for ...

The era of the voice-only mobile phone is behind us. While voice will always be a key driver for mobile phone use, today's 3G handsets are multimedia systems with color displays, games, audio, video, ...

CUPERTINO, Calif. & PARIS -- November 26, 2007 -- SEQUANS Communications, leading WiMAX chipmaker, announced today that USI (Universal Scientific Industrial), a leading global networking and ...

PARIS--(BUSINESS WIRE)--Sequans Communications S.A. (NYSE: SQNS), leading provider of LTE for IoT chips and modules, announced that its Monarch SiP (system-in-package) and Monarch GM01Q module, have ...