German laser specialist LPKF has developed and patented a plastic that can survive reflow soldering and which can act as a single-layer PCB. The company's polyimide material is impregnated with a ...
Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will ...
Over the years, the semiconductor industry has witnessed a parade of packaging innovations, such as system-in-package, semiconductor embedded in substrate, and fan-out wafer-level packaging. Two ...
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