Full-blown process excursions that affect every wafer are comparatively easy for fabs to detect and fix. However, “onesie-twosie,” lower-volume excursions can go unresolved for months or even years.

A new technical paper titled “DECOR: Deep Embedding Clustering with Orientation Robustness” was published by researchers at Oregon State University and Micron Technology. “In semiconductor ...

Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...

The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...

“Wafer mass metrology has become increasingly important as semiconductor processes have become more complex and sensitive,” said Microtronic CEO Reiner Fenske in making the announcement. “Today’s fabs ...

KLA leverages cutting-edge semiconductor inspection tech, partnering with industry leaders like TSMC and Samsung. This positions them to capitalize on the growing demand for 2nm and 3nm chip ...

SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips Second-generation “cold field emission” technology provides high-resolution imaging AI image recognition ...

This article is the second in a series from PDF Solutions on why adopting big data platforms will transform the compound semiconductor industry. The first part “Accelerating silicon carbide (SiC) ...

Semiconductor fabrication facilities risk substantial financial exposure from incoming wafers defects. With typical lot sizes of 25 wafers and finished wafer values ranging from $4,000 to $17,000, ...

Semiconductor fabrication facilities risk substantial financial exposure from incoming wafers defects. With typical lot sizes of 25 wafers and finished wafer values ranging from $4,000 to $17,000, ...